Potting is a process used to shield electronic components with resins, which can be epoxy, polyurethane, or silicone. Once cured, the resin creates a barrier against moisture, dust, vibrations, and chemicals, increasing the durability and reliability of devices.
Widely used across various sectors, such as automotive and electronics, potting is a versatile solution for enhancing the performance and resilience of circuits.
B-Fluid's technical expertise enables them to adapt to specific customer requirements to design and develop the most suitable potting system for every need.
An example is the system for encapsulating electronic boards presented below.
Dual pressurized tank with mixer, heating, load cell, and degassing system.
Precise proportioning and dispensing of two components, unaffected by temperature and viscosity variations.
A camera captures an image of the pallets to identify the quantity and correct positioning of the boards to be processed.
All dosing and motion parameters are monitored via a dedicated electrical panel.
The system complies with the requirements needed to access benefits provided by applicable regulations.
The operator loads a pallet of electronic boards and starts the machine cycle. Through a conveyor belt, the pallet reaches the dosing station.
Here, an image is captured by the vision system, which detects the presence and position of the parts to be potted and controls the motion and dosing cycle accordingly.
A volumetric two-component pump performs the dosing to encapsulate the electronic components with a self-leveling resin.
Once this operation is completed, the pallet is ready for the next station: a vertical storage integrated with the potting machine, where the resin is given sufficient time to cure.
The machine integrates seamlessly into an existing assembly line, creating a fully customized and highly efficient solution.
For your potting processes, we’re just a click away.